发明授权
US06805431B2 Heater chip with doped diamond-like carbon layer and overlying cavitation layer
有权
加热芯片采用掺杂金刚石碳层和上覆空穴层
- 专利标题: Heater chip with doped diamond-like carbon layer and overlying cavitation layer
- 专利标题(中): 加热芯片采用掺杂金刚石碳层和上覆空穴层
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申请号: US10334109申请日: 2002-12-30
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公开(公告)号: US06805431B2公开(公告)日: 2004-10-19
- 发明人: Frank Edward Anderson , Byron V Bell , Yimin Guan , George Keith Parish , Robert Cornell
- 申请人: Frank Edward Anderson , Byron V Bell , Yimin Guan , George Keith Parish , Robert Cornell
- 主分类号: B41J205
- IPC分类号: B41J205
摘要:
An inkjet printhead heater chip has a silicon substrate with a heater stack formed of a plurality of thin film layers thereon for ejecting an ink drop during use. The thin film layers include: a thermal barrier layer on the silicon substrate; a resistor layer on the thermal barrier layer; a doped diamond-like carbon layer on the resistor layer; and a cavitation layer on the doped diamond-like carbon layer. The doped diamond-like carbon layer preferably includes silicon but may also include nitrogen, titanium, tantalum, combinations thereof or other. When it includes silicon, a preferred silicon concentration ranges from 20 to 25 atomic percent. A preferred cavitation layer includes an undoped diamond-like carbon, tantalum or titanium layer. The doped diamond-like carbon layer ranges in thickness from 500 to 3000 angstroms. The cavitation layer ranges from 500 to 6000 angstroms. Inkjet printheads and printers are also disclosed.
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