发明授权
US06805958B2 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same
有权
环氧树脂组合物，使用该组合物的粘合膜和预浸料，使用它们的多层印刷布线板及其制造方法
- 专利标题： Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same
- 专利标题（中）： 环氧树脂组合物，使用该组合物的粘合膜和预浸料，使用它们的多层印刷布线板及其制造方法
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申请号： US10164403申请日： 2002-06-10
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公开(公告)号： US06805958B2公开(公告)日： 2004-10-19
- 发明人: Shigeo Nakamura , Tadahiko Yokota
- 申请人： Shigeo Nakamura , Tadahiko Yokota
- 优先权： JP11-291503 19991013; JP2000-302070 20001002
- 主分类号： B32B2738
- IPC分类号： B32B2738
摘要：
The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, wherein the epoxy resin (A) contains a phosphorus atom, and wherein 5 to 50 parts by weight of the phenoxy resin (C) and 0.05 to 10 parts by weight of the curing accelerator (D) are mixed with 100 parts by weight in total of the epoxy resin (A) and the phenolic curing agent (B).