发明授权
- 专利标题： Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure
- 专利标题（中）： 电极连接方法，电极表面激活装置，电极连接装置，电子部件的连接方法和连接结构
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申请号： US10347224申请日： 2003-01-21
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公开(公告)号： US06806118B2公开(公告)日： 2004-10-19
- 发明人: Keishiro Okamoto , Masataka Mizukoshi , Yasuo Yamagishi
- 申请人： Keishiro Okamoto , Masataka Mizukoshi , Yasuo Yamagishi
- 优先权： JP2002-031025 20020207; JP2002-031089 20020207
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
An electrode connecting method of connecting a first electrode and a second electrode is disclosed. The respective bonding surfaces of the first and second electrodes are activated. Then, each of the first and second electrodes having the activated surfaces is coated with a coating member for maintaining an activated state. A solid state bond between the first electrode and the second electrode is formed by pressure welding the first electrode and the second electrode so that the first and second electrodes break through the coating members.
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