发明授权
- 专利标题: Robust via structure and method
- 专利标题(中): 坚固的通过结构和方法
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申请号: US10364190申请日: 2003-02-11
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公开(公告)号: US06806579B2公开(公告)日: 2004-10-19
- 发明人: Andy Cowley , Michael Stetter , Erdem Kaltalioglu
- 申请人: Andy Cowley , Michael Stetter , Erdem Kaltalioglu
- 主分类号: H01L2144
- IPC分类号: H01L2144
摘要:
A conductive line is formed in a first insulating layer. A second insulating layer is formed over the conductive line and the first insulating layer. A via extends through the second insulating layer to contact at least the top surface of the conductive line. The via also extends through the first insulating layer to contact at least a top portion of at least one sidewall of the conductive line. The conductive line sidewall may include an outwardly extending hook region, so that a portion of the via is disposed beneath the conductive line hook region, forming a locking region within the via proximate the conductive line hook region.
公开/授权文献
- US20040157442A1 ROBUST VIA STRUCTURE AND METHOD 公开/授权日:2004-08-12
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