An optical communication module includes (a) at least one light-emitting device, at least one light-receiving device, or a combination of these; (b) an optically coupling means coupled optically with the device or each device; (c) an electric-circuit part connected to the device or each device; (d) multiple layers of electroconductive media supporting the device or devices, the optically coupling means or these optically coupling means, and the electric-circuit part or parts; and (e) a connector portion formed at the end portion of each of the electroconductive media. The insertion of the next-stage circuit substrate between the connector portions enables the electrical connection between the module and the next-stage circuit substrate having a multitude of leads without requiring a large space. An insulating spacer placed between the layers of the electroconductive media secures the electrical and thermal insulation. The module has a property of high-speed response.