发明授权
- 专利标题: Connector apparatus
- 专利标题(中): 连接器装置
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申请号: US10404080申请日: 2003-04-02
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公开(公告)号: US06808421B2公开(公告)日: 2004-10-26
- 发明人: Akira Okada , Satoshi Moriyama , Manabu Shimizu , Hideo Miyazawa
- 申请人: Akira Okada , Satoshi Moriyama , Manabu Shimizu , Hideo Miyazawa
- 优先权: JP2002-248062 20020828
- 主分类号: H01R13648
- IPC分类号: H01R13648
摘要:
A first connector includes a first connector body; first contacts provided in an end face of the first connector body in a matrix-like manner, each of the first contacts having a first contact point; and first shield plates provided between adjacent first contact points of the first contacts in a row direction, the first shield plates extending in a column direction of the first contact points, and shielding at least the adjacent first contact points in each row. A second connector includes a second connector body; second contacts provided in an end face of the second connector body in a matrix-like manner, each of the second contacts having a second contact point, the second contact points making contact with and being electrically connected to the first contact points; and second shield plates provided between adjacent second contact points of the second contacts in a column direction, the second shield plates extending in a row direction of the second contact points and shielding at least the adjacent second contact points in each column. At least one of the first and second shield plates are formed with slits receiving ends of the other one of the first and second shield plates. The first and second shield plates are configured and arranged to be engaged in a grid pattern by connecting the first and second connectors so that a contact part including the first and second contact points is arranged within one element defined by the grid pattern.
公开/授权文献
- US20040043661A1 Connector apparatus 公开/授权日:2004-03-04
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