A lead frame having a body with oppositely facing, substantially planar, first and second surfaces respectively facing in first and second directions and residing in first and second substantially parallel reference planes. The body defines a support for a semiconductor chip and a plurality of leads. The support has a third surface facing in the first direction to which a semiconductor chip can be mounted, and a fourth surface facing in the second direction. At least a part of the fourth surface is spaced from the second reference plane towards the first reference plane.