A probe card transmits high frequency signals between an integrated circuit under test and a semiconductor-testing device. The probe card includes a substrate, a signal transmission path formed on the substrate, a contactor formed on an end portion of the signal transmission path on one side of the substrate, a grounding conductor grounded, and a hole. The contactor is made of a metallic glass material, which shows a nature of viscous fluidity in the supercooled liquid region. The contactor is separated from the substrate over the hole. The contactor elastically contacts a pad of the circuit under test.