发明授权
- 专利标题： System for forming conductor wire on a substrate board
- 专利标题（中）： 用于在基板上形成导线的系统
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申请号： US10685844申请日： 2003-10-14
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公开(公告)号： US06810580B2公开(公告)日： 2004-11-02
- 发明人: Shigeo Yamaguchi , Masaaki Arahori , Toshio Yamamoto , Toshimitsu Nishiwaki
- 申请人： Shigeo Yamaguchi , Masaaki Arahori , Toshio Yamamoto , Toshimitsu Nishiwaki
- 优先权： JP11-126988 19990507; JP11-229171 19990813; JP11-255856 19990909; JP11-259069 19990913
- 主分类号： B23P1900
- IPC分类号： B23P1900
摘要：
A wiring system is provided. Using the system, a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head for guiding the wire conductor and the substrate such that the wiring head relatively moves along an adhesive layer on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact.
公开/授权文献
- US20040074086A1 Method for forming conductor wire on a substrate board 公开/授权日：2004-04-22