发明授权
- 专利标题： Semiconductor module and method of manufacturing the same
- 专利标题（中）： 半导体模块及其制造方法
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申请号： US09810151申请日： 2001-03-16
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公开(公告)号： US06812410B2公开(公告)日： 2004-11-02
- 发明人: Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Yukio Okada , Yusuke Igarashi , Eiju Maehara , Kouji Takahashi
- 申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Yukio Okada , Yusuke Igarashi , Eiju Maehara , Kouji Takahashi
- 优先权： JPP.2000-326841 20001026
- 主分类号： H05K116
- IPC分类号： H05K116
摘要：
A first metal film 14 made of a Cu plated film is formed on a radiation substrate 13A made of Al, and an island 15 exposed from a back surface of a semiconductor device 10 is adhered thereto. At that time, the back surface of the semiconductor device 10 is brought into contact with contact areas, and a first opening portion OP is opened larger than an arranging area of the semiconductor device 10. Accordingly, the cleaning can be executed via the first opening portion OP exposed from peripheries of the semiconductor device 10. In addition, the heat generated from semiconductor elements 16 can be radiated excellently from the island 15 via a second supporting member 13A.