发明授权
- 专利标题: Semiconductor device and a method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US10265324申请日: 2002-10-07
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公开(公告)号: US06812554B2公开(公告)日: 2004-11-02
- 发明人: Toshinori Hirashima , Munehisa Kishimoto , Toshiyuki Hata , Yasushi Takahashi
- 申请人: Toshinori Hirashima , Munehisa Kishimoto , Toshiyuki Hata , Yasushi Takahashi
- 优先权: JP11-38124 19990217; JP11-372510 19991228
- 主分类号: H01L23495
- IPC分类号: H01L23495
摘要:
A semiconductor device having high output and a method of manufacturing the same are disclosed in which external resistance is reduced and radiating performance is improved. A MOSFET (70) comprises a plurality of inner leads electrically connected to a surface electrode of a semiconductor pellet having a field effect transistor on a principal surface thereof, a connecting portion for electrically connecting the surface electrode of the semiconductor pellet and the inner leads, a resin encapsulant (29) formed by encapsulating the semiconductor pellet with resin, a plurality of outer leads (37), (38) protruding in parallel from the same lateral surface of the resin encapsulant (29) and a header (28) bonded to a back surface of the semiconductor pellet and having a header protruding portion (28c) protruding from a lateral surface of the resin encapsulant (29) opposite to the lateral surface from which the outer leads protrude, wherein the header (28) has an exposed surface (28b) exposed from the resin encapsulant (29); the outer leads (37), (38) are bent; and the exposed of the outer leads (37), (38) are provided at substantially the same height.
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