Invention Grant
US06816030B2 Impedance matching circuit for rejecting an image signal via a microstrip structure
失效
用于通过微带结构拒绝图像信号的阻抗匹配电路
- Patent Title: Impedance matching circuit for rejecting an image signal via a microstrip structure
- Patent Title (中): 用于通过微带结构拒绝图像信号的阻抗匹配电路
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Application No.: US10065290Application Date: 2002-10-01
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Publication No.: US06816030B2Publication Date: 2004-11-09
- Inventor: Sheng-Fuh Chang , Jia-Liang Chen , Cheng-Cheng Liu
- Applicant: Sheng-Fuh Chang , Jia-Liang Chen , Cheng-Cheng Liu
- Priority: TW91103203A 20020222
- Main IPC: H01P1203
- IPC: H01P1203

Abstract:
An impedance matching circuit for providing a lossless target signal transmission and rejecting image signals of heterodyne and super-heterodyne transceiver. The impedance matching circuit includes a grounded metal membrane, a first microstrip line connected with an input circuit, a second microstrip line connected with an output circuit, and a third microstrip line connected with either the first microstrip line or the second microstrip line. The first microstrip line is not connected with the second microstrip line, and the length of the third microstrip line is equal to a quarter wavelength of an image signal. When the target signal and the image signal transmit to the impedance matching circuit, the image signal will bypass to a grounded metal membrane, and the target signal will transmit to the output circuit without signal decay through electromagnetic coupling of the first microstrip line and the second microstrip line.
Public/Granted literature
- US20030160662A1 Impedance matching circuit for rejecting an image signal via a microstrip structure Public/Granted day:2003-08-28
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