A heat dissipation device for dissipating heat from an electronic package (80) includes a heat sink (10) and a fan (30). The heat sink includes a base (12) and a plurality of fins (14). The base has a first surface (122) in thermal contact with the electronic package and a pair of sloped heat dissipation surfaces (126). The fins are perpendicularly attached on the heat dissipation surfaces. The fan is supported on the heat sink. During operation of the heat dissipation device, the cooling air is drawn into the heat sink by the fan and exits the heat sink along the heat dissipation surfaces.