发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US10016142申请日: 2001-12-17
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公开(公告)号: US06818492B2公开(公告)日: 2004-11-16
- 发明人: Hirotoshi Kubo , Shigeyuki Murai , Hisaaki Tominaga , Hidetaka Sawame
- 申请人: Hirotoshi Kubo , Shigeyuki Murai , Hisaaki Tominaga , Hidetaka Sawame
- 优先权: JP2000-397716 20001227
- 主分类号: H01L218238
- IPC分类号: H01L218238
摘要:
This invention provides a semiconductor device which is excellent in high-frequency characteristics, wherein emitter diffusion is performed by a trench formed in a base region, the base resistance is further reduced, and the base-emitter capacitance is also reduced. A base electrode layer makes a contact with the whole surface of the base region. A tapered trench is provided in the base region. A finer emitter region is formed by emitter diffusion from the bottom portion of the trench. Since the base electrode is formed adjacently to the trench, the distance between an active region of the base and the base electrode layer can be shortened and a larger grounded area of a base can also be obtained, therefore the base resistance can be substantially reduced. In addition, by forming a fine region, the base-emitter capacitance between the base and emitter can also be reduced, therefore a transistor excellent in high-frequency characteristics can be obtained.
公开/授权文献
- US20020127814A1 Semiconductor device and manufacturing method thereof 公开/授权日:2002-09-12
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