发明授权
US06818858B2 Laser processing unit and processing apparatus comprising laser processing unit 有权
激光处理单元和包括激光处理单元的处理设备

  • 专利标题: Laser processing unit and processing apparatus comprising laser processing unit
  • 专利标题(中): 激光处理单元和包括激光处理单元的处理设备
  • 申请号: US10352964
    申请日: 2003-01-29
  • 公开(公告)号: US06818858B2
    公开(公告)日: 2004-11-16
  • 发明人: Hisashi YasodaMasato Fukushima
  • 申请人: Hisashi YasodaMasato Fukushima
  • 主分类号: B23K2638
  • IPC分类号: B23K2638
Laser processing unit and processing apparatus comprising laser processing unit
摘要:
There are provided a laser processing unit easily detachable for replacement from the main body of a processing apparatus, excellent in maintainability, and capable of performing an efficient perforating operation and a processing apparatus having the laser processing unit. A casing detachable from the main body 1 of processing apparatus into which a work W is carried is composed integrally of a unit one half portion, a unit other half portion disposed in opposing relation to the unit one half portion with a work insertion space interposed therebetween, and a connecting portion for connecting the unit one half portion and the unit other half portion to each other. Optical means for guiding a laser beam emitted from a laser emission port into a processing area located above the unit other half portion and focusing the guided laser beam therein is provided in the unit one half portion. A beam receiving plate which transmits the laser beam is provided in the processing area.
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