发明授权
- 专利标题: Discharge electrode for a wire bonding apparatus
- 专利标题(中): 用于引线接合装置的放电电极
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申请号: US10671089申请日: 2003-09-25
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公开(公告)号: US06818861B2公开(公告)日: 2004-11-16
- 发明人: Toru Maeda
- 申请人: Toru Maeda
- 优先权: JP2002-282935 20020927
- 主分类号: B23K3100
- IPC分类号: B23K3100
摘要:
A straight rod form discharge electrode used in a wire bonding apparatus. The electrode core material is covered, except for its tip end, by an alumina film that has been subjected to a pore sealing treatment. The alumina film subjected to the pore sealing treatment is formed by a two-stage process. In the first-stage, an alumina film having a porous structure is formed on the surface of the electrode core material for the thickness of approximately 6 &mgr;m by plasma flame coating method or anodic oxidation method; and in the second-stage, the porous structure is subjected to a pore sealing treatment in which an alumina film is caused to adhere to the porous structure by laser PVD or a pore sealing treatment is performed with a resin.
公开/授权文献
- US20040060915A1 Discharge electrode for a wire bonding apparatus 公开/授权日:2004-04-01
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