发明授权
- 专利标题: Laminated electronic component, laminated duplexer and communication device
- 专利标题(中): 层压电子元件,层压双工器和通信设备
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申请号: US10221971申请日: 2003-01-10
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公开(公告)号: US06822534B2公开(公告)日: 2004-11-23
- 发明人: Kazuhide Uriu , Hiroyuki Nakamura , Toru Yamada , Tsutomu Matsumura , Hiroshi Kagata , Kouji Kawakita , Toshio Ishizaki
- 申请人: Kazuhide Uriu , Hiroyuki Nakamura , Toru Yamada , Tsutomu Matsumura , Hiroshi Kagata , Kouji Kawakita , Toshio Ishizaki
- 优先权: JP2000-072830 20000315; JP2000-072831 20000315; JP2000-072832 20000315
- 主分类号: H03H701
- IPC分类号: H03H701
摘要:
A laminated filter includes: a first dielectric layer having a first shield electrode on one principal plane; a second dielectric layer having resonator electrodes on one principal plane; a third dielectric layer having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer having a second shield electrode on one principal plane; a fifth dielectric layer whose at least one principal plane is exposed outside; and a grounding electrode provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole provided in the above-described first dielectric layer.
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