Invention Grant
- Patent Title: Surface-mount coil and method for manufacturing same
- Patent Title (中): 表面贴装线圈及其制造方法
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Application No.: US10336941Application Date: 2003-03-25
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Publication No.: US06825746B2Publication Date: 2004-11-30
- Inventor: Kazuhiko Otsuka , Satoshi Kinoshita , Tomohiko Morijiri , Tomoo Kashiwa
- Applicant: Kazuhiko Otsuka , Satoshi Kinoshita , Tomohiko Morijiri , Tomoo Kashiwa
- Priority: JP11-335735 19991126
- Main IPC: H01F2702
- IPC: H01F2702

Abstract:
A surface mountable coil is provided with a drum-shaped core including a body portion and raised portion each raised portion having a peripheral surface and an end surface, a winding wire wound around the body portion, an encapsulating member, base electrodes, and terminal electrodes. The encapsulating member exposes some portions of the base electrodes on the peripheral surfaces and substantially the whole base electrodes on the end surfaces. By exposing the portions of the base electrodes on the peripheral surfaces and whole base electrodes on the end surfaces, the contact strength between the base electrodes and the terminal electrodes can be substantially increased.
Public/Granted literature
- US20040021541A1 Surface-mount coil and method for manufacturing same Public/Granted day:2004-02-05
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