发明授权
- 专利标题： Chip size stack package and method of fabricating the same
- 专利标题（中）： 芯片尺寸堆叠封装及其制造方法
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申请号： US10423872申请日： 2003-04-28
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公开(公告)号： US06828686B2公开(公告)日： 2004-12-07
- 发明人: Sang Wook Park
- 申请人： Sang Wook Park
- 优先权： KR99-24627 19990628
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A chip size stack package includes two semiconductor chips arranged such that their bond pads-forming surfaces are opposed and insulating layers are applied thereto. Via-holes for exposing bond pads are formed in the insulating layers. Metal traces exposed at both sides of the insulating layers are formed on the via-holes, whereby the insulating layers are bonded to each other and the metal traces are bonded to each other. Ends of metal wires are connected to the metal traces exposed at the insulating layers, and both sides of the chips are molded by an encapsulate leaving the other ends of the metal wires exposed.