The present invention relates to a temperature measurement device, particularly to a temperature measurement device for the cold junction of a non-contact temperature measurement element, characterized in that a plurality of electrical-conductive pins is provided on the bottom surface of a base. A sensor element for detecting object temperature and a heat-conductive elongated block are provided on the top surface of the base, the heat-conductive elongated block having a sensor element for detecting ambient temperature secured on the top surface thereof, wherein the heat capacity of the sensor element for detecting ambient temperature together with that of the heat-conductive elongated block will approximately be equal to that of the sensor element for detecting object temperature, such that the heat-balance constants of the sensor element for detecting ambient temperature and the cold junction of the sensor element for detecting object temperature will virtually coincide with each other at an abrupt temperature change. Consequently, the dynamic temperature difference between the sensor element for detecting ambient temperature and the cold junction of the sensor element for detecting object temperature may be diminished. In this manner, not only the accuracy of the temperature measurement from the detected object may be raised significantly, but also the sensitivity of the measurement may be maintained effectively.