发明授权
- 专利标题： Thermal preconditioning fixed abrasive articles
- 专利标题（中）： 热预处理固定磨料制品
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申请号： US09454354申请日： 1999-12-03
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公开(公告)号： US06832948B1公开(公告)日： 2004-12-21
- 发明人: Manoocher Birang , Ramin Emami , Shijian Li , Fred C. Redeker
- 申请人： Manoocher Birang , Ramin Emami , Shijian Li , Fred C. Redeker
- 主分类号： B24B100
- IPC分类号： B24B100
摘要：
The CMP removal rate of a fixed abrasive article is increased and wafer-to-wafer uniformity enhanced by thermal preconditioning. Embodiments include preconditioning a fixed abrasive article by heating with hot water to a temperature of about 90° C. to about 100° C. to increase and stabilize the Cu or Cu alloy CMP removal rate.