Invention Grant
US06833299B2 Method of fabricating a stacked poly-poly and MOS capacitor using a sige integration scheme
失效
使用奇数积分方案制造堆叠多晶硅和MOS电容器的方法
- Patent Title: Method of fabricating a stacked poly-poly and MOS capacitor using a sige integration scheme
- Patent Title (中): 使用奇数积分方案制造堆叠多晶硅和MOS电容器的方法
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Application No.: US10292204Application Date: 2002-11-12
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Publication No.: US06833299B2Publication Date: 2004-12-21
- Inventor: Douglas D. Coolbaugh , James Stuart Dunn , Stephen Arthur St. Onge
- Applicant: Douglas D. Coolbaugh , James Stuart Dunn , Stephen Arthur St. Onge
- Main IPC: H01L218244
- IPC: H01L218244

Abstract:
A stacked Poly-Poly/MOS capacitor useful as a component in a BiCMOS device comprising a semiconductor substrate having a region of a first conductivity-type formed in a surface thereof; a gate oxide formed on said semiconductor substrate overlaying said region of first conductivity-type; a first polysilicon layer formed on at least said gate oxide layer, said first polysilicon layer being doped with an N or P-type dopant; a dielectric layer formed on said first polysilicon layer; and a second polysilicon layer formed on said dielectric layer, said second polysilicon layer being doped with the same or different dopant as the first polysilicon layer.
Public/Granted literature
- US20030092239A1 Method of fabricating a stacked poly-poly and MOS capacitor using a sige integration scheme Public/Granted day:2003-05-15
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