发明授权
- 专利标题： Method for producing semiconductor laser components
- 专利标题（中）： 半导体激光器部件的制造方法
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申请号： US09932878申请日： 2001-08-20
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公开(公告)号： US06835603B2公开(公告)日： 2004-12-28
- 发明人: Bruno Acklin , Stefan Grötsch
- 申请人： Bruno Acklin , Stefan Grötsch
- 优先权： DE10040450 20000818
- 主分类号： H01L2150
- IPC分类号： H01L2150
摘要：
A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components.
公开/授权文献
- US20030211708A1 Method for producing semiconductor laser components 公开/授权日：2003-11-13