Invention Grant
US06835898B2 ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES
失效
电气接触结构通过配置柔性线形成具有可弹性形状并在至少一层耐用导电材料上覆盖电线，将接触结构安装到电子部件上的方法以及用于接触结构的应用
- Patent Title: ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES
- Patent Title (中): 电气接触结构通过配置柔性线形成具有可弹性形状并在至少一层耐用导电材料上覆盖电线，将接触结构安装到电子部件上的方法以及用于接触结构的应用
-
Application No.: US09746960Application Date: 2000-12-21
-
Publication No.: US06835898B2Publication Date: 2004-12-28
- Inventor: Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
- Applicant: Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
- Main IPC: H01R1204
- IPC: H01R1204
Abstract:
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.
Public/Granted literature
Information query
