Invention Grant
US06836561B2 Method and system for detecting a defect in projected portions of an object having the projected portions formed in the same shape with a predetermined pitch along an arc 失效
用于检测具有沿着弧形以预定间距以相同形状形成的突出部分的物体的突出部分中的缺陷的方法和系统

  • Patent Title: Method and system for detecting a defect in projected portions of an object having the projected portions formed in the same shape with a predetermined pitch along an arc
  • Patent Title (中): 用于检测具有沿着弧形以预定间距以相同形状形成的突出部分的物体的突出部分中的缺陷的方法和系统
  • Application No.: US09854607
    Application Date: 2001-05-15
  • Publication No.: US06836561B2
    Publication Date: 2004-12-28
  • Inventor: Tsuyoshi NakajimaMasami TakeshiNaoya MurotaYutaka Miyahara
  • Applicant: Tsuyoshi NakajimaMasami TakeshiNaoya MurotaYutaka Miyahara
  • Priority: JP2000-149546 20000522
  • Main IPC: G06K900
  • IPC: G06K900
Method and system for detecting a defect in projected portions of an object having the projected portions formed in the same shape with a predetermined pitch along an arc
Abstract:
A defect detection method and system which can provide a precise determination of whether an object is acceptable without being affected by the position of placement and the rotational orientation of the object. An arc circumscribing the tip of modules of a sprocket is determined. Then, each overlapping region is extracted which is formed by an overlapping portion between an inner portion of a region defined by the arc and the cut-away portion of the sprocket. The area of each overlapping region is determined and compared with each other. In accordance with a determination of whether each area difference falls within the predetermined range of criteria &egr;, it is determined whether a chipped portion exists on the tip of module. If there is a chipped portion on the tip of module, two or more overlapping regions are integrated with each other to form a larger overlapping region, thereby making it possible to determine easily and positively the presence of a chipped portion on the tip of module.
Information query
Patent Agency Ranking
0/0