Invention Grant
- Patent Title: Bending press system
- Patent Title (中): 弯曲印刷机系统
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Application No.: US10285643Application Date: 2002-11-01
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Publication No.: US06843760B2Publication Date: 2005-01-18
- Inventor: Ichio Akami , Takahiro Ogawa , Masaaki Sato , Goujyu Umemoto , Toshiyuki Kondo
- Applicant: Ichio Akami , Takahiro Ogawa , Masaaki Sato , Goujyu Umemoto , Toshiyuki Kondo
- Applicant Address: JP
- Assignee: Amada Company, Limited
- Current Assignee: Amada Company, Limited
- Current Assignee Address: JP
- Agency: Blank Rome LLP
- Priority: JP11-6914 19990113
- Main IPC: B21D5/02
- IPC: B21D5/02 ; B21D37/14 ; B23Q3/155 ; B21D37/00 ; B21D37/02 ; B21D37/04

Abstract:
A bending press system provided with a bending press (1) with at least one bending station to mount a plurality of divided tools and, tool housing devices (65, 123) to house divided metals to be used on the bending press and, tool exchange devices (61, 143) which mount said divided tools on the bending station, in which are provided a first memory means (403) which stores housed positions of each divided tool housed in the housing devices and a second memory means (405) which stores the bending line length of the bent part, the flange length and the bending angle of the bent product and, a first computation means (407) which, based on the bending line length, flange length, bending angle, computes the tool (cross section shape) type and the length of the bending station, and a second computation means (409) which, based on the tool type and length of the bending station computes the arrangement of each divided tool on the bending station, and an NC control means (411) which controls the tool exchange device so that each divided tool is moved from the housed position in the housing device to the determined arrangement position.
Public/Granted literature
- US20030092547A1 Bending press system Public/Granted day:2003-05-15
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