发明授权
US06844214B1 Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication
失效
基于微机电系统的传感器，传感器阵列，感测系统，感测方法和制造方法
- 专利标题： Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication
- 专利标题（中）： 基于微机电系统的传感器，传感器阵列，感测系统，感测方法和制造方法
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申请号： US10604850申请日： 2003-08-21
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公开(公告)号： US06844214B1公开(公告)日： 2005-01-18
- 发明人: Ping Mei , Decai Sun , Robert A. Street
- 申请人： Ping Mei , Decai Sun , Robert A. Street
- 申请人地址： US CT Stamford
- 专利权人： Xerox, Corporation
- 当前专利权人： Xerox, Corporation
- 当前专利权人地址： US CT Stamford
- 代理机构： Oliff & Berridge, PLC
- 主分类号： B81B3/00
- IPC分类号： B81B3/00 ; H01L21/00 ; H01L23/48 ; H01R11/22
摘要：
A microelectromechanical system (MEMS) based sensor comprises: a substrate defining a plane; a first conductive material layer having a first stress, a first portion of the first conductive material layer being connected to the substrate and extending in a substantially parallel direction to the plane defined by the substrate and a second portion being disconnected from the substrate and extending in a substantially non-parallel direction to the plane defined by the substrate; and a sensor material layer formed over at least the second portion of the first conductive material layer, the sensor material layer having a second stress that is less than the first stress of the first conductive material layer. The stresses form a stress gradient that bends the second portion of the first conductive material layer and the sensor material layer formed over the second portion of the first conductive material layer away from the substrate.
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