Invention Grant
- Patent Title: Chemical mechanical polishing with multiple polishing pads
- Patent Title (中): 化学机械抛光与多个抛光垫
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Application No.: US10425684Application Date: 2003-04-28
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Publication No.: US06848976B2Publication Date: 2005-02-01
- Inventor: Sasson Somekh
- Applicant: Sasson Somekh
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson
- Main IPC: B24B7/22
- IPC: B24B7/22 ; B24B37/04 ; B24B49/12 ; B24D13/14
Abstract:
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.
Public/Granted literature
- US20030190865A1 Chemical mechanical polishing with multiple polishing pads Public/Granted day:2003-10-09
Information query
