发明授权
- 专利标题: Machining program preparation apparatus
- 专利标题(中): 加工程序准备装置
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申请号: US10258352申请日: 2001-05-17
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公开(公告)号: US06850814B2公开(公告)日: 2005-02-01
- 发明人: Takashi Kamiya
- 申请人: Takashi Kamiya
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 国际申请: PCTJP01/04111 WO 20010517
- 国际公布: WO0209551 WO 20021128
- 主分类号: B23Q15/00
- IPC分类号: B23Q15/00 ; G05B19/00 ; G05B19/4097 ; G05B19/4099 ; G06F19/00
摘要:
A machining program preparation apparatus includes a machining region extracting unit (3) that extracts a machining region (300) based on a given three-dimensional part shape (100) and a given three-dimensional material shape (200), an envelope shape generating unit (4) that generates a three-dimensional envelope shape (400) that envelopes the given three-dimensional part shape (100) based on this part shape, a turning region extracting unit (5) that extracts a three-dimensional turning region (500) from the material shape (200) and the envelope shape (400), and a milling region extracting unit (6) that extracts a three-dimensional milling region (600) from the machining region (300) extracted by the machining region extracting unit (3) and the turning region (500) extracted by the turning region extracting unit (5).
公开/授权文献
- US20030130757A1 Machining program preparation apparatus 公开/授权日:2003-07-10
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