Invention Grant
- Patent Title: Pin-assignment method for integrated circuit packages to increase the electro-static discharge protective capability
- Patent Title (中): 集成电路封装的引脚分配方法，以提高静电放电保护能力
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Application No.: US10281069Application Date: 2002-09-16
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Publication No.: US06852568B2Publication Date: 2005-02-08
- Inventor: Shi-Tron Lin
- Applicant: Shi-Tron Lin
- Applicant Address: TW
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW
- Agent Raymond Sun
- Priority: TW86115577A 19971022
- Main IPC: H01L23/60
- IPC: H01L23/60 ; H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A pin-assignment method is provided for use on an IC package to arrange pin connections. The pin-assignment method can allow an improvement in the electro-static discharge (ESD) protection capability for the IC chip packed in the IC package. Specifically, the pin-assignment method organizes the no-connect pins of the IC package into groups and then assigns each of the two pins that bound each no-connect pin group to be connected to a power bus of the IC chip. This allows for an increased ESD protective capability for the no-connect pins. Moreover, the pin-assignment method can simplify the wiring complexity of the IC package.
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Information query
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