Invention Grant
- Patent Title: TAB tape for semiconductor package
- Patent Title (中): TAB胶带用于半导体封装
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Application No.: US10359080Application Date: 2003-02-06
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Publication No.: US06853090B2Publication Date: 2005-02-08
- Inventor: Dong Han Kim , Hyoung Ho Kim
- Applicant: Dong Han Kim , Hyoung Ho Kim
- Applicant Address: KR Kyungki-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Kyungki-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR2002-20682 20020416
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/28 ; H01L23/498 ; H01L23/50 ; H01L23/58 ; H01L29/40 ; H01L31/0328
Abstract:
A TAB tape for a semiconductor package is provided. The TAB tape provides number of test pad configuration for reducing the area of the test pad area on a TAB tape to increases the number of packages that may be prepared from a length of TAB tape. The TAB tape comprises a base film having a chip mounting area for mounting at least one semiconductor device and a wiring pattern formed on the base film with test pads formed at the ends of the output terminal patterns. A predetermined number of the test pads are arranged in rows form a group wherein the number of rows is less than the number of test pads in the group. Groups of the test pads are consecutively arranged across the TAB tape to provide the number of test pads necessary for testing the semiconductor device(s).
Public/Granted literature
- US20030197200A1 TAB tape for semiconductor package Public/Granted day:2003-10-23
Information query
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