发明授权
- 专利标题： Copper paste and wiring board using the same
- 专利标题（中）： 铜膏和接线板使用相同
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申请号： US10620595申请日： 2003-07-17
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公开(公告)号： US06855399B2公开(公告)日： 2005-02-15
- 发明人: Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
- 申请人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
- 申请人地址： JP Aichi
- 专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人地址： JP Aichi
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2002-208322 20020717; JP2002-208323 20020717
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H01L23/498 ; H05K1/09 ; H05K3/40 ; B32B9/00 ; B32B3/00 ; H01B1/02
摘要：
A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe2O3 particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.
公开/授权文献
- US20040013860A1 Copper paste and wiring board using the same 公开/授权日：2004-01-22