发明授权
- 专利标题： Insulation sheet, multi-layer wiring substrate and production processes thereof
- 专利标题（中）： 绝缘片，多层布线基板及其制造方法
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申请号： US10246476申请日： 2002-09-19
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公开(公告)号： US06855892B2公开(公告)日： 2005-02-15
- 发明人: Shingo Komatsu , Seiichi Nakatani , Yasuhiro Sugaya , Toshiyuki Asahi , Yoshiyuki Yamamoto
- 申请人： Shingo Komatsu , Seiichi Nakatani , Yasuhiro Sugaya , Toshiyuki Asahi , Yoshiyuki Yamamoto
- 申请人地址： JP Osaka-fu
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka-fu
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2001-296819 20010927
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K3/40 ; H05K3/46 ; H01R12/04
摘要：
An insulation sheet for use in producing a wiring substrate comprises, as via bole conductors, conductive paste filled in via holes formed through the insulation sheet, and a curing-starting temperature of the conductive paste is lower than a melting-starting temperature of the insulation sheet. A wiring substrate is produced by laminating such insulation sheets, that have conductive paste in via holes, and subjecting this laminate to thermo-compression bonding, wherein deformation of via holes and dislocation of the via holes, because of a molten insulation sheet, does not occur.
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