发明授权
- 专利标题： Stacked chip package with heat transfer wires
- 专利标题（中）： 具有传热线的堆叠芯片封装
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申请号： US10719670申请日： 2003-11-20
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公开(公告)号： US06857470B2公开(公告)日： 2005-02-22
- 发明人: Hee-Jin Park , Tae-Gyeong Chung , Eun-Chul Ahn
- 申请人： Hee-Jin Park , Tae-Gyeong Chung , Eun-Chul Ahn
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Marger, Johnson & McCollom PC
- 优先权： KR10-2002-0072256 20021120
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/31 ; H01L23/36 ; H01L25/065 ; H01L21/50 ; F28F7/00
摘要：
The present invention provides a stacked chip package having at least one heat transfer wire. The heat transfer wire is disposed between the stacked chips and at least one end of each transfer wire is connected to a dummy pad provided on the board. Therefore, the heat generated by the chips and trapped between the chips can be effectively dissipated. The heat transfer wires can be formed on the uppermost chip of the stacked chips to enhance the heat dissipation. In addition, by controlling the number or the size of the heat transfer wire, the thermal characteristics of the stacked chip package can be modified.
公开/授权文献
- US20040196635A1 Stacked chip package with heat transfer wires 公开/授权日：2004-10-07
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