Invention Grant
- Patent Title: Low signal loss bonding ply for multilayer circuit boards
- Patent Title (中): 多层电路板的低信号损耗键合层
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Application No.: US10289984Application Date: 2002-11-07
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Publication No.: US06861092B2Publication Date: 2005-03-01
- Inventor: Thomas F. McCarthy , David L. Wynants, Sr.
- Applicant: Thomas F. McCarthy , David L. Wynants, Sr.
- Applicant Address: US NY Petersburg
- Assignee: Tonoga, Inc.
- Current Assignee: Tonoga, Inc.
- Current Assignee Address: US NY Petersburg
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Mary Louise Gioeni, Esq.
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/38 ; H05K3/46 ; B05D5/10
Abstract:
A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
Public/Granted literature
- US20030072929A1 Low signal loss bonding ply for multilayer circuit boards Public/Granted day:2003-04-17
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