发明授权
- 专利标题： Stacked semiconductor packages and method for the fabrication thereof
- 专利标题（中）： 堆叠的半导体封装及其制造方法
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申请号： US10676736申请日： 2003-09-30
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公开(公告)号： US06861288B2公开(公告)日： 2005-03-01
- 发明人: Il Kwon Shim , Kambhampati Ramakrishna , Seng Guan Chow , Byung Joon Han
- 申请人： Il Kwon Shim , Kambhampati Ramakrishna , Seng Guan Chow , Byung Joon Han
- 申请人地址： SG Singapore
- 专利权人： ST Assembly Test Services, Ltd.
- 当前专利权人： ST Assembly Test Services, Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L25/10 ; H01L25/16 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A method for fabricating a stacked semiconductor package includes providing a substrate and mounting a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is then mounted on the interposer.