发明授权
- 专利标题： Row slicing method in tape head fabrication
- 专利标题（中）： 磁带头制造中的行切片方法
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申请号： US10346033申请日： 2003-01-15
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公开(公告)号： US06863061B2公开(公告)日： 2005-03-08
- 发明人: Annayya P. Deshpande , Calvin Shyhjong Lo , Kevin Thuy Luong , Artemio Juan Torres
- 申请人： Annayya P. Deshpande , Calvin Shyhjong Lo , Kevin Thuy Luong , Artemio Juan Torres
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Zilka-Kotab, PC
- 主分类号： B28D5/00
- IPC分类号： B28D5/00 ; B28D5/02 ; G11B5/31 ; B28D1/02
摘要：
A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.
公开/授权文献
- US20040134477A1 Row slicing method in tape head fabrication 公开/授权日：2004-07-15