Invention Grant
- Patent Title: Base for heat sink
- Patent Title (中): 散热器底座
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Application No.: US09938892Application Date: 2001-08-24
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Publication No.: US06864572B2Publication Date: 2005-03-08
- Inventor: Cheng Chi Lee , Xue Jin Fu , Zheng Liang Liu , Wen Qiu Deng
- Applicant: Cheng Chi Lee , Xue Jin Fu , Zheng Liang Liu , Wen Qiu Deng
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/36 ; H01L23/367 ; H01L23/34

Abstract:
A heat sink base (10) includes a rectangular body (11) made of aluminum and a circular core (12) made of copper. The body defines a circular through opening (111). A diameter of the opening is slightly less than a diameter of the core. The core is attached within the body according to the following steps: a) pressing the core into the through opening of the body; b) stamping the core to cause it to plastically deform in radial directions and thereby become firmly combined with the body; and c) removing any burring of the core flowing out from the opening such that surfaces of the core and the body are coplanarly smooth.
Public/Granted literature
- US20030037433A1 Base for heat sink Public/Granted day:2003-02-27
Information query
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