Invention Grant
- Patent Title: Method of manufacturing metal electrode
- Patent Title (中): 制造金属电极的方法
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Application No.: US09857721Application Date: 2000-10-18
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Publication No.: US06869751B1Publication Date: 2005-03-22
- Inventor: Hideki Asida , Shinya Fujiwara , Hideki Marunaka , Tadashi Nakagawa , Keisuke Sumida , Hideaki Yasui , Kazuhiko Sugimoto , Hiroyosi Tanaka
- Applicant: Hideki Asida , Shinya Fujiwara , Hideki Marunaka , Tadashi Nakagawa , Keisuke Sumida , Hideaki Yasui , Kazuhiko Sugimoto , Hiroyosi Tanaka
- Applicant Address: JP Osaka-fu
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka-fu
- Priority: JP11-296323 19991019; JP11-357232 19991216
- International Application: PCTJP00/07225 WO 20001018
- International Announcement: WO0129859 WO 20010426
- Main IPC: H01J9/02
- IPC: H01J9/02 ; H01J17/49 ; G03C5/00

Abstract:
A manufacturing method for a metal electrode used for a bus electrode, a data electrode, and the like which make up a display panel including a PDP (Plasma Display Panel) by which, when these electrodes are patterned according to a photolithographic method, the edge curl phenomenon can be substantially controlled to the extent that the phenomenon is negligible. The manufacturing method of the invention therefore includes a dry step for drying the layers making up the metal electrode so that flows (F1, F2, and F3) of the solvent occur from a region having a high absorbency of the solvent to a region having a lower absorbency of the solvent.
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