Invention Grant
- Patent Title: Electron-beam focusing apparatus and electron-beam projection lithography system employing the same
- Patent Title (中): 电子束聚焦装置和采用该方法的电子束投影光刻系统
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Application No.: US10792849Application Date: 2004-03-05
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Publication No.: US06870173B2Publication Date: 2005-03-22
- Inventor: Chang-wook Moon , In-kyeong Yoo , Dong-wook Kim
- Applicant: Chang-wook Moon , In-kyeong Yoo , Dong-wook Kim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Lee, Sterba & Morse, P.C.
- Priority: KR10-2003-0014483 20030307
- Main IPC: G21K1/093
- IPC: G21K1/093 ; G03F7/20 ; G03F7/207 ; G21K5/04 ; H01J37/305 ; H01J37/317 ; H01L21/027

Abstract:
An electron-beam focusing apparatus for controlling a path of electron beams emitted from an electron-beam emitter in an electron-beam projection lithography (EPL) system includes top and bottom magnets for creating a magnetic field within a vacuum chamber, the top and bottom magnets disposed above and below the vacuum chamber into which a wafer is loaded, respectively; upper and lower pole pieces magnetically contacting the top and bottom magnets, respectively, the upper and lower pole pieces penetrating a top wall and a bottom wall of the vacuum chamber, respectively; and upper and lower projections having a circular shape, extending outwardly from facing surfaces of the upper and lower pole pieces, respectively.
Public/Granted literature
- US20040173755A1 Electron-beam focusing apparatus and electron-beam projection lithography system employing the same Public/Granted day:2004-09-09
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