发明授权
- 专利标题: Transfer material for wiring substrate
- 专利标题(中): 接线基板的转移材料
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申请号: US09778709申请日: 2001-02-07
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公开(公告)号: US06871396B2公开(公告)日: 2005-03-29
- 发明人: Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
- 申请人: Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
- 申请人地址: JP Kadoma
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Kadoma
- 优先权: JP2000-031422 20000209; JP2000-110307 20000412; JP2000-324524 20001024
- 主分类号: H05K1/03
- IPC分类号: H05K1/03 ; H05K1/16 ; H05K3/20 ; H05K3/40 ; H01R43/02
摘要:
A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.