发明授权
US06874948B2 System, method and apparatus for fiber bonding procedure for optoelectronic packaging
失效
用于光电子封装的光纤粘合程序的系统,方法和装置
- 专利标题: System, method and apparatus for fiber bonding procedure for optoelectronic packaging
- 专利标题(中): 用于光电子封装的光纤粘合程序的系统,方法和装置
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申请号: US10077530申请日: 2002-02-14
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公开(公告)号: US06874948B2公开(公告)日: 2005-04-05
- 发明人: Mark Brian Farrelly , Theodore David Bennett
- 申请人: Mark Brian Farrelly , Theodore David Bennett
- 申请人地址: US CA Oakland
- 专利权人: The Regents of the University of California
- 当前专利权人: The Regents of the University of California
- 当前专利权人地址: US CA Oakland
- 代理机构: Greenberg Traurig, LLP
- 代理商 Charles Berman, Esq.
- 主分类号: G02B6/255
- IPC分类号: G02B6/255 ; G02B6/30 ; G02B6/36 ; G02B6/42 ; G02B6/26
摘要:
A method and apparatus for bonding optical fibers are disclosed. A fiber bonding device feeds an optical fiber through a supportive sheath having a ceramic tip at its end. The optical fiber extends slightly beyond the ceramic tip and is aligned with the focal point of a laser, which causes the end of the optical fiber to melt, forming a molten region. The ceramic tip then extends partially into a substrate surface, causing the molten region of the optical fiber to become bonded to the substrate. The process is controlled by computer logic, such that it is an automated, precision process for bonding optical fibers.
公开/授权文献
- US20020110331A1 Fiber bonding procedure for optoelectronic packaging 公开/授权日:2002-08-15
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