发明授权
US06878036B2 Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal
有权
用于使用相位差信号在化学机械抛光期间监测金属层的装置
- 专利标题： Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal
- 专利标题（中）： 用于使用相位差信号在化学机械抛光期间监测金属层的装置
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申请号： US10446878申请日： 2003-05-27
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公开(公告)号： US06878036B2公开(公告)日： 2005-04-12
- 发明人: Hiroji Hanawa , Nils Johansson , Bogusla W Swedek , Manoocher Birang
- 申请人： Hiroji Hanawa , Nils Johansson , Bogusla W Swedek , Manoocher Birang
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fish & Richardson
- 主分类号： B24B37/013
- IPC分类号： B24B37/013 ; B24B37/20 ; B24B49/02 ; B24B49/12 ; G01B7/06 ; G01N27/90 ; H01L21/00 ; B24B49/00 ; B24B51/00
摘要：
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
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