发明授权
- 专利标题： Printed circuit board assembly with multi-channel block-type optical devices packaged therein
- 专利标题（中）： 印刷电路板组件，其中封装有多通道块型光学器件
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申请号： US10743216申请日： 2003-12-22
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公开(公告)号： US06879423B2公开(公告)日： 2005-04-12
- 发明人: Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang
- 申请人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang
- 申请人地址： KR Kyinggi-Do
- 专利权人： Samsung Electro-Mechanics Co., LTD
- 当前专利权人： Samsung Electro-Mechanics Co., LTD
- 当前专利权人地址： KR Kyinggi-Do
- 代理机构： Gottlieb, Rackman & Reisman, P.C.
- 优先权： KR10-2002-0085312 20021227
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; G02B6/43 ; G02F1/03 ; F16F3/08 ; G02B6/12 ; H01L23/48 ; H04B10/00
摘要：
The present invention discloses an optical printed circuit board assembly with multi-channel block-type optical devices packaged therein, the printed circuit board assembly including a plate type heat spreader, a driving printed circuit board die bonded to a top of the heat spreader to convert electrical and optical signals to optical and electrical signals, respectively, a driving integrated circuit, die bonded to the top of the heat spreader and wire bonded to the driving printed circuit board.
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