发明授权
US06881649B2 Method of making device chips collectively from common material substrate
有权
从普通材料基板集中制造器件芯片的方法
- 专利标题： Method of making device chips collectively from common material substrate
- 专利标题（中）： 从普通材料基板集中制造器件芯片的方法
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申请号： US10352001申请日： 2003-01-28
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公开(公告)号： US06881649B2公开(公告)日： 2005-04-19
- 发明人: Norinao Kouma , Yoshihiro Mizuno , Hisao Okuda , Ippei Sawaki , Osamu Tsuboi , Yoshitaka Nakamura
- 申请人： Norinao Kouma , Yoshihiro Mizuno , Hisao Okuda , Ippei Sawaki , Osamu Tsuboi , Yoshitaka Nakamura
- 申请人地址： JP Kawasaki JP Nagano
- 专利权人： Fujitsu Limited,Fujitsu Media Devices Limited
- 当前专利权人： Fujitsu Limited,Fujitsu Media Devices Limited
- 当前专利权人地址： JP Kawasaki JP Nagano
- 代理机构： Staas & Halsey LLP
- 优先权： JP2002-210197 20020718
- 主分类号： B81C1/00
- IPC分类号： B81C1/00 ; G02B26/08 ; H01L21/301 ; H01L21/46 ; H01L21/78
摘要：
A plurality of micromirror chips are collectively made from a common substrate. Each of the micromirror chips is formed with a micromirror unit including a frame, a mirror-forming portion separate from the frame via spaces, and torsion bars connecting the mirror-forming portion to the frame. The common substrate is subjected to etching to provide the spaces and make division grooves for dividing the common substrate into the individual micromirror chips. The etching for the spaces and the etching for the division grooves are performed in parallel with each other.
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