Invention Grant
- Patent Title: Hot melt adhesive system having centralized manifold and zone heating capability
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Application No.: US10278394Application Date: 2002-10-23
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Publication No.: US06883684B2Publication Date: 2005-04-26
- Inventor: David R. Jeter , David F. Andel
- Applicant: David R. Jeter , David F. Andel
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Wood, Herron & Evans, L.L.P.
- Main IPC: B05C5/04
- IPC: B05C5/04 ; B05C11/10 ; B67D5/62

Abstract:
A dispensing unit for a hot melt adhesive system has a manifold centrally located within the dispensing unit to permit commonality between heated hoses of substantially the same length used to supply adhesive guns at either side of the dispensing unit. The dispensing unit also includes a manifold that is thermally isolated from the adhesive tank. The manifold has a heater that is independent of the tank heater for more precise temperature control of adhesive flowing through the manifold. A pump coupled to the manifold is located external to the tank and is heated by the manifold heater.
Public/Granted literature
- US20030080156A1 Hot melt adhesive system having centralized manifold and zone heating capability Public/Granted day:2003-05-01
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