Invention Grant
- Patent Title: Passivation processing over a memory link
- Patent Title (中): 通过内存链接进行钝化处理
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Application No.: US10361206Application Date: 2003-02-07
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Publication No.: US06887804B2Publication Date: 2005-05-03
- Inventor: Yunlong Sun , Robert F. Hainsey , Lei Sun
- Applicant: Yunlong Sun , Robert F. Hainsey , Lei Sun
- Applicant Address: US OR Portland
- Assignee: Electro Scientific Industries, Inc.
- Current Assignee: Electro Scientific Industries, Inc.
- Current Assignee Address: US OR Portland
- Agency: Stoel Rives LLP
- Main IPC: B23K26/04
- IPC: B23K26/04 ; B23K26/06 ; H01L23/525 ; H01L21/82

Abstract:
A set (50) of one or more laser pulses (52) is employed to remove passivation layer (44) over a conductive link (22). The link (22) can subsequently be removed by a different process such as chemical etching. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.05 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly material removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each target area (51). Conventional wavelengths in the IR range or their harmonics in the green or UV range can be employed.
Public/Granted literature
- US20030222330A1 Passivation processing over a memory link Public/Granted day:2003-12-04
Information query
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