发明授权
- 专利标题: Tool-less coupling system for electronic modules
- 专利标题(中): 电子模块无工具耦合系统
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申请号: US10641598申请日: 2003-08-15
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公开(公告)号: US06898088B2公开(公告)日: 2005-05-24
- 发明人: George D. Megason , Joseph R. Allen , Henry C. Coles , Dit Charoen
- 申请人: George D. Megason , Joseph R. Allen , Henry C. Coles , Dit Charoen
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: H05K7/14
- IPC分类号: H05K7/14 ; H02B1/01
摘要:
A technique is provided for coupling and uncoupling device boards for a computer system during any operational state of the computer system. A tool-free latch assembly is provided for coupling a device switchboard and the device boards to a mounting structure of the computer system. The tool-free latch also may have a transparent portion for transmitting light from a device status light to interior and exterior areas of the computer system. A non-mechanical switch also may be utilized in conjunction with the tool-free latch assembly to control power to the device boards.
公开/授权文献
- US20040052063A1 Tool-less coupling system for electronic modules 公开/授权日:2004-03-18
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