- 专利标题: Multi-layer integrated circuit package
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申请号: US10109792申请日: 2002-03-29
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公开(公告)号: US06899815B2公开(公告)日: 2005-05-31
- 发明人: Boyd L. Coomer , Michael Walk
- 申请人: Boyd L. Coomer , Michael Walk
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L21/48
- IPC分类号: H01L21/48 ; H05K3/10 ; H05K3/38 ; H05K3/44 ; H05K3/46 ; H01B13/00
摘要:
Adhesive material is applied to a surface of a metallic core layer. The adhesive material is removed from a conductive region of the metallic core layer. A metallic contact is provided over the conductive region of the metallic core layer. The metallic core layer is laminated to an imprinted buildup layer, the buildup layer having a dielectric region and a conductive region, wherein a nonconductive region of the metallic core layer is bonded to the dielectric region of the buildup layer and the conductive region of the metallic core layer is bonded to the conductive region of the imprinted-buildup layer.
公开/授权文献
- US20030184987A1 Multi-layer integrated circuit package 公开/授权日:2003-10-02