发明授权
- 专利标题： Method of cutting CSP substrates
- 专利标题（中）： 切割CSP基板的方法
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申请号： US09752563申请日： 2001-01-03
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公开(公告)号： US06901924B2公开(公告)日： 2005-06-07
- 发明人: Takahiro Saito
- 申请人： Takahiro Saito
- 申请人地址： JP Tokyo
- 专利权人： Disco Corporation
- 当前专利权人： Disco Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Smith, Gambrell & Russell, LLP
- 优先权： JP2000-003533 20000112
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; B28D1/02 ; B28D1/04 ; H01L21/00 ; H01L21/301 ; H01L21/304 ; H01L21/68
摘要：
A method of cutting, along the cutting streets, the CSP substrates in which CSPs are formed on each of plural rectangular regions thereof sectioned by the cutting streets arranged in a form of a lattice. The method comprises the steps of mounting plural CSP substrates on a single frame without overlapping them one upon the other, recognizing the mounting position of each of the CSP substrates on the frame and storing the mounting positions in a storage means, securing the frame mounting the plural CSP substrates onto a chuck, imaging the surface of each of the CSP substrates by a precision imaging means, and recognizing the positions of the cutting streets of each of the CSP substrates by analyzing the obtained image and storing the positions of the cutting streets of the storage means. At the time of imaging the surface of each of the CSP substrates by the precision imaging means, the chuck to which the frame is secured is positioned relatively with respect to the precision imaging means based on the stored mounting position of each of the CSP substrates on the frame.
公开/授权文献
- US20010007253A1 Method of cutting CSP substrates 公开/授权日：2001-07-12